The annual meeting of Qualcomm is being presently held in Hawaii, the United States, where it usually announces its new version of the flagship chipset for the forthcoming smartphones.
According to the leaked details ahead of the launch, the chipset is named as Snapdragon 855 and will be manufactured on the 7nm process by TSMC, and comes with a dedicated Neural Processing Unit (NPU), which is claimed to provide three times better performance compared to the existing ones.
The internal name of the new platform is Snapdragon 8150, although it will not be used for marketing purposes. It is also hinted that the Snapdragon 855 mobile platform is the “world’s first commercial mobile platform with support for 5G”.
The new Snapdragon 855 is integrated with the Snapdragon X50 modem along with Snapdragon X24 LTE modem built specifically to answer demands for 5G connectivity. The CPU is packed with three clusters, the mightiest clocked at 2.84 GHz paired with the GPU Adreno 640……….Read More>>